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ESDEMC 科技有限公司条款(等待翻译)

条款

付款

All payments are due upon receipt. If a payment is not received or payment method is declined, the buyer forfeits the ownership of any items purchased. If no payment is received, no items will be shipped.

Shipping Policies

Shipping will be paid for by the buyer in the amount agreed upon by the seller at the time of purchase. If an item is lost during shipping, the total cost of item, including shipping, will be refunded to the buyer by the seller. Shipping costs may increase significantly if shipping internationally. If an item is damaged during shipping, the buyer will not be held responsible.

If a buyer places an order greater than $1000 USD before shipping charges are calculated, then the buyer is also responsible for a shipping insurance fee of 1% of the order’s total value before adding any relevant shipping charges.

 Cancellation

An item may be cancelled up until payment has been processed. Once payment has been processed, the buyer is responsible for payment.

 Refund/Return Policy

A. Product Eligibility

Products may be eligible for return to ESDEMC Technology LLC under the following conditions:

      1. When the product has been ordered by the customer in error, the following types of products are NOT eligible for return:-       Custom products (i.e, products designed, manufactured or configured to meet specific customer requirements);-       Repair parts that are flagged by ESDEMC Technology LLC as non-returnable; and

        –       Products with expired shelf life.

      2. When there is an ESDEMC Technology LLC error associated with the product, including the following:-     the Customer receives a product different from the product ordered;-     the Customer receives a product damaged in transit; or

        –     the customer receives a “DOA” (dead on arrival) product

      3. Any product that is identified as eligible for return by ESDEMC Technology LLC and has been purchased within the last 30 days.

B.  Product Return Charges

    1. For returns based on customer error, ESDEMC Technology LLC may at its discretion charge 15% of the net purchase price of the product as a return/restocking fee.  If a return fee is charged, it may be deducted from the return credit to the customer.

    2. For returns based on customer error where the customer has operated the product, ESDEMC Technology LLC may at its discretion charge an additional fee of 15% of the net purchase price of the product for the refurbishment of the product. If a refurbishment fee is charged, it may be deducted from the return credit to the customer.
  • For returns based on customer error, the customer will pay return freight charges to a location specified by ESDEMC Technology LLC.

  • For returns based on error by ESDEMC Technology LLC, ESDEMC Technology LLC will pay return freight charges and the customer will not be charged any return/restocking or refurbishment fees.

 

C.  Release of Credit

Credit memorandums over $500 USD (or the local currency equivalent) will not be issued to the customer until the product has been physically received by ESDEMC Technology LLC.  In its discretion, ESDEMC Technology LLC may provide credit memorandums under $500 USD to the customer prior to product receipt.

Credit memorandums are calculated as follows: the original invoice amount less any of the charges listed in Section (B) above. Post-invoice price changes to said product, both decreases and increases, will not affect the credit calculation.

Credit memorandums will be issued to customers within 15 working days from the date said product has been physically received by ESDEMC Technology LLC.

D. Initiating a Return

To initiate a return, you will need to retrieve your order number. It will be included on the order’s receipt, and can also be found on your online account’s Orders page. Call or email us with the order number, the product you wish to return, and why you are returning it.

If your product is eligible for return (as described in the relevant section of these Terms and Conditions), we will provide instructions on how to return the item. Once we have received the item and determined that no other fees are necessary, credit memorandums will be issued, as described in the relevant section of these Terms and Conditions.

IN-COMPANY SERVICE CONDITION:

Pricing Policy

Repair prices after 1-year warranty is $100 USD/hour plus parts. ESDEMC Technology LLC offers 1-hour free evaluation, diagnosis, and estimate. No service will be performed unless authorized by the customer.

During the time of repair, the customer can request a free demo unit if needed.

Special Order

Any special order requests for parts that we do not carry or have in stock will have to be purchased through a third party vendor. Special order parts generally take anywhere from 3-10 business days.

We are not liable for any shipping delays or defective parts that are sent to us from the vendor. We will do our best to meet the customers’ requirements but we cannot control third party vendors. There will be no discounts over the misinterpretation or misunderstanding of this policy. ESDEMC Technology LLC will not accommodate special orders if the delivery of your device or part is time sensitive.

Warranty Policy

Services provided by ESDEMC Technology LLC come with a 1-year labor and parts warranty. The warranty will be voided if there is any evidence of improper handling, improper use, physical damage, water damage, or tampering. ESDEMC Technology LLC is not responsible for any additional damages discovered that were not noted prior to service and any software related issues prior, during, and after repair. There are no refunds on repairs or accessory sales.

There will be no returns on any labor extensive repairs unless approved by a manager.

Returns/Refunds

We accept returns for damage or defective accessories within 30 days and with receipt only. We will charge a 15% restocking fee on any parts used and return for any other reason. There will be no returns on any labor extensive repairs unless approved by a manager.

Complaints

Any complaints about items or sellers may be sent to our support team: [email protected] or (573) 202-6411. ESDEMC Technology LLC will respond within 24 hours during business hours

The seller is not responsible for any health or safety concerns once the buyer has received the item. If any harm is incurred from the items purchased by the buyer, the seller shares no responsibility.

These terms and conditions are subject to change. It is the buyer’s responsibility to review this privacy policy periodically and become aware of modifications.

I have read and agree to the terms and conditions.

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Wei Huang

Wei Huang

 

Wei Huang
Wei Huang

创始人,董事长,CEO

Wei Huang于 2010年获得密苏里科技大学电子工程硕士学位,于2007年获得北京邮电大学电子工程学士学位。他曾在密苏里科技大学电磁兼容实验室任研究助理,主要方向为电磁兼容,静电,以及射频设计。他是ESDEMC科技有限公司的创始人及董事长,现在致力于ESD和EMC的创新测试方案研发。

iNARTE 认证的电磁兼容工程师

Wei Huang has been an iNARTE Certified EMC Engineer from 2009 (The youngest iNARTE EMC Engineer, 23 years old )

2009年,Wei Huang 成为 iNARTE 认证的EMC工程师(最年轻的 iNARTE EMC 工程师, 23 岁)

专业背景

  • 密苏里科技大学 (前密苏里州立大学罗拉分校), 美国, 电子工程硕士, 2010.
  • 北京邮电大学,中国,电子工程学士, 2007.

职务

  • 2010年 – 至今       ESDEMC科技有限公司创始人,董事长
  • 2009年夏              苹果公司,硬件工程师,便携系统EE组
  • 2007年 – 2010年  研究助理,密苏里科技大学(前密苏里州立大学罗拉分校)EMC实验室
  • 2005年 – 2007年  北京HJH S&T责任有限公司硬件设计工程师,产品设计组

发表论文

  1. W Huang , J Dunnihoo , D Pommerenke, “Effects of TVS Integration on System Level ESD Robustness”, 2010 International EOS/ESD Symposium, Reno, NV, USA, Oct. 3 – 8
  1. W Huang, D Liu, J Xiao, D Pommerenke J Min, G Muchaidze, “Probe Characterization and Data Process for Transient Current Reconstruction by Near Field Scanning Method”, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, Beijing, China, Apr. 12 – 16
  1. Xiao, D. Liu, D. Pommerenke, W Huang, P. Shao, X. Li, J. Ming, G. Muchaidze, “Near Field Probe for Detecting Resonances in EMC Application”, EMC COMPO 2009, 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Nov. 17 – 19
  1. W.Huang, D. Pommerenke, J. Xiao, D. Liu, J. Ming, G. Muchaidze, S. Kwon, “A Measurement Technique for ESD Current Spreading on A PCB using Near Field Scanning”, Present on 2009 IEEE International Symposium on EMC, Austin, Texas, Aug. 17 – 21
  1. M. Giorgi, W. Huang, M. Jin, P. Shao, D. James , D. Pommerenke, “Automated Near-Field Scanning to Identify Resonances”, EMC Europe 2008, Hamburg, Germany, Sep. 8-1
  2. W. Huang, M. Jin, P. Shao, D. James , D. Pommerenke, “Automated Near-Field Scanning to Identify Resonances”, EMC Europe 2008, Hamburg, Germany, Sep. 8-1
  3. W. Huang, J Tichenor, D. Pommerenke, V. Pilla, P. Maheshwari, G. Maghlakelidze, “An Ethernet Cable Discharge Event (CDE) test and measurement system”, 2014 IEEE International Symposium on EMC, North Carolina, Raleigh, Aug. 3 – 8

协作者&合作编辑

  1. David Pommerenke, 密苏里科技大学电磁兼容实验室教授
  2. Jerry Tichenor, Fredric Stevenson, ESDMEC科技有限公司产品设计部成员

研究生导师

  • David Pommerenke教授

 

 

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David Pommerenke

David Pommerenke

 

David Pommerenke
David Pommerenke

技术顾问, IEEE 会士  

Pommerenke教授自ESDEMC公司创办即为公司的技术顾问。 他在静电放电(ESD)和电磁兼容(EMC)方面的渊博知识极大的帮助了我们的团队,指导了公司许多产品的设计和研发工作。

专业背景

  • 柏林科技大学,德国,电子工程博士,1995.
  • 柏林科技大学,德国,电子工程学士,1989.

职务

  • 2008年 – 至今,     美国密苏里科技大学,电子计算机工程学院,教授
  • 2001年 – 2008年,美国密苏里科技大学,电子计算机工程学院,助理教授
  • 1996年 – 2001年, 美国Hewlett Packard公司,电磁兼容研究和测试工程师
  • 1995年 – 1996年,  德国柏林科技大学,博士后
  • 1990年 -1995年,   德国柏林科技大学,高电压动力工程学院,助理研究员

5篇最有影响力论文

  1. Ghasr, Mohammad Tayeb, Mohamed A. Abou-Khousa, Sergey Kharkovsky, R. Zoughi, and David Pommerenke. “Portable real-time microwave camera at 24 GHz.” Antennas and Propagation, IEEE Transactions on, 2012, 60, no. 2, pp. 1114-1125.
  2. Fallahpour, M., M. Baumgartner, A. Kothari, M.T. Ghasr, D. Pommerenke and R. Zoughi, “Compact Ka-Band One-Port Vector Reflectometer using a Wideband Electronically-Controlled Phase-Shifter,” IEEE Transactions on Instrumentation and Measurement, October 2012, Vol. 61, no. 10, pp. 2817-2826
  3. Bishop, J. A.; Pommerenke, D. J.; Chen, G., ‘,A Rapid-Acquisition Electrical Time-Domain Reflectometer for Dynamic Structure Analysis ‘, IEEE Trans. Instrumentation and Measurement, 2011, Vol. 60/2 pp. 655-661,
  4. Muchaidze, G., Jayong Koo, Qing Cai, Tun Li, Lijun Han, Martwick, A., Kai Wang, Jin Min, Drewniak, J.L., Pommerenke, D., “Susceptibility Scanning as a Failure Analysis Tool for System-Level Electrostatic Discharge (ESD) Problems”, IEEE Trans. EMC, May 2008, Vol 50, No. 2, pp.268-276
  5. Koo, J., Cai, Q.; Muchaidze, G.,Martwick, A., Wang, K.; Pommerenke, D., “Frequency-Domain Measurement Method for the Analysis of ESD Generators and Coupling”, IEEE Trans. EMC, 49/3, August 2007, pp.504-511

其他论文

  • Tianqi Li; Maeshima, J.; Shumiya, H.; Pommerenke, D.J.; Yamada, T.; Araki, K, “An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone”, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on, August 2012, pp. 346-350
  • Khilkevich, V.; Pommerenke, D.; Li Gang; Xu Shuai, “An inductive probe for the measurement of common mode currents on differential traces”, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on, 2012, pp. 720-724
  • Jianmin Zhang; Drewniak, J.L.; Pommerenke, D.J.; DuBroff, R.E.; Zhiping Yang; Wheling Cheng; Fisher, J.; Camerlo, S.; “Signal link-path characterization up to 20 GHz based on a stripline structure”, IEEE Int. Symp. on EMC, 2006 14-18 Aug. Vol. 2, pp.356-361
  • Bhargava, A.; Pommerenke, D.; Kam, K.W.; Centola, F.; Cheng Wei Lam; , “DC-DC Buck Converter EMI Reduction Using PCB Layout Modification,” Electromagnetic Compatibility, IEEE Transactions on , Vol.53, no.3, pp.806-813, Aug. 2011
  • Abou-Khousa, M.A.; Ghasr, M.T.; Kharkovsky, S.; Pommerenke, D.; Zoughi, R.; , “Modulated Elliptical Slot Antenna for Electric Field Mapping and Microwave Imaging,” Antennas and Propagation, IEEE Transactions on , Vol.59, no.3, March 2011, pp.733-741

参与与协同活动

  • IEC TC77b标准 美国代表
  • IEEE EMC协会成员, TC-9, 计算电磁学
  • EMC EOS/ESD研讨会,编辑委员(1996 – 2000)
  • 欧洲EMC协会,编辑委员,2002
  • IEEE, 电磁兼容协会,电介质与绝缘协会成员

协作者 & 其他成员

协作者&合作编辑

  • Daryl Beetner, James L. Drewniak, Richard E. DuBroff, and David Pommerenke, 密苏里科技大学电磁兼容实验室教授
  • Bruce Archambeault, 杰出工程师, IBM, 北卡罗莱纳;
  • Brice Achkir, 杰出工程师, Cisco, 加利福利亚;

研究生导师及博士后资助人

  • 硕士: Prof. Dr.-Ing Wilfried Kalkner.
  • 博士: Prof. Dr.-Ing W. Wilfried Kalkner.