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General Test and Analysis
Calibration Services
Design Services
General Test and Analysis
Transmission Line Pulse (TLP) Testing

Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the device under test (DUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP). The incident and reflected pulses are evaluated, and a voltage-current (V-I) curve is developed that describes the response of an ESD protection structure to the applied TLP stresses. The Transmission Line Pulse current pulses can be on the order of amps, and the TLP test results can show the turn-on, snap-back, and hold characteristics of the ESD protection structure.

Transmission Line Pulse testing is useful in two very important ways. First, TLP may be used to characterize Input/Output (I/O) pad cells on test chips for new process technologies and Intellectual Property (IP). TLP results are very useful in developing simulation parameters, and for making qualitative comparisons of the relative merit of different ESD protection schemes for innovative pad cell designs. Secondly, TLP may be used as an electrical failure analysis tool, often in combination with conventional, standards-based component ESD testing.

TLP test services are quoted on a case-by-case basis, based on the scope of the work requested; estimated engineering time to perform the test and customer requested reporting. Please kindly fill out below service requirement form with your test configurations for the quote purpose.

Test Request Form (download) 

Related Standards:  ANSI/ESD STM5.5.1-2016, IEC 62615:2010

Test Capability (customized setup available upon request):

  • Rise Time:
    Standard Options of 0.2, 0.5, 1, 2, 5, 10 ns,
    Other options ranging from 40 ps to 1.2 us are available up on request, customer should define in 20-80 % or 10-90 % specifications.
  • Pulse Width:
    Standard Options of 1, 2, 5, 10, 100, 200, 500 ns, other options range from 500 ps to 2000 ns are available up on request
  • Maximum Pulse Level:
    • TLP & vf-TLP with rise time >= 0.3ns:              100 A into short, (150A coming soon)
    • Vf-TLP with rise time < 0.3 ns:                          40 A into short
    • Vf-TLP with rise time < 0.1 ns:                          20 A into short
  • TLP Test Impedance:
    • 50 Ω for standard TDR-O and TDR-S Setup,
    • 500 Ω or higher available for TLP Setup.
TVS Performance Characterization

TLP / vf-TLP Measurement

TLP and VF-TLP testing can provide a comprehensive ESD characterization for devices. TLP (pulse width of 100ns, typically) is often used to generate an IV curve which can be analyzed to understand many of a device’s ESD protection characteristics such as dynamic resistance, trigger voltage, hold voltage, and current, and second breakdown (Vt2/It2). A VF-TLP test is often used to understand the transient response of a DUT. Initial voltage peak and turn-on time can be measured and may play a large role in choosing the best protection device for a design. When analyzing this data, it is important to understand the device under protection and the system operating conditions.

  • TLP Configuration                tr <1 nS, tp=100 nS
  • vf-TLP Configuration           tr <0.2 nS, tp= 10 nS
S21 / S21dd Measurement

In design applications where signal integrity is important, low-loss devices at the frequencies of interest should be selected. ESDEMC’s S21 measurements will provide the customer with insertion loss data up to 18GHz. Temperature and DC bias control are available upon request.

  • Insertion Loss (dB) @ 1, 2.5, 5 GHz (Raw Data up to 18 GHz)
VNA Capacitance Measurement

Capacitance is a component parameter that can be crucial for circuit design, whether it is in a low frequency or high-frequency application. Protection devices and capacitors have an expected and desired capacitance that may be important for signal integrity or general circuit operation. Based on the frequency, temperature, and DC bias applied to the DUT, the capacitance may be much different than expected. ESDEMC’s VNA capacitance measurements allow for capacitance measurements to be taken at a specific DC bias level and temperature. The capacitance can be measured using VNA S- parameters swept up to 18GHz.

  • Cj @1 GHz, 5 GHz, 10 GHz (Raw data up to 18 GHz)
  • DC Bias (Vrmw-min to Vrmw-max)
  • Temperature Sweep from 0 – 85C, no dew

 

LCR Capacitance Measurement

Capacitance is a component parameter that can be crucial for circuit design, whether it is in a low frequency or high-frequency application. Protection devices and capacitors have an expected and desired capacitance that may be important for signal integrity or general circuit operation. Based on the frequency, temperature, and DC bias applied to the DUT, the capacitance may be much different than expected. ESDEMC’s LCR  capacitance measurements allow for capacitance measurements to be taken at a specific DC bias level and temperature. The capacitance can be measured at frequencies lower than the VNA measurement method can achieve. The typical measurement frequencies are taken at 1 MHz – 10 MHz.

  • Cj @1 MHz
  • DC Bias (Vrmw-min to Vrmw-max)
  • Temperature Sweep from 0 – 85C, no dew
Harmonic Generation Measurement

High frequency protection devices often generate harmful and unwanted harmonic frequencies. The power of these undesirable harmonics may play an important factor in selecting the proper device for a design. ESDEMC’s harmonics generation measurement provides harmonic power data that will aid in making these design decisions. Base frequencies of 900MHz, 2.4GHz, and 5GHz can be injected into the DUT at power levels ranging from -30dBm to +30dBm. Resulting second and third harmonic power levels will be measured. Custom frequency and power ranges may be measured upon request.

  • 2nd and 3rd harmonics of (900MHz, 2.4GHz, 5GHz)
ESD Simulator Clamping Measurement

IEC ESD Simulator testing is a qualification requirement for designs, mostly system level. The system-level tests are well-outlined in the IEC standard and are often simply pass/fail. Device level tests are performed in the industry as well, but these tests are also often simply pass/fail. ESDEMC’s ESD Simulator Clamping measurements provide more than just pass/fail data for device-level ESD Simulator tests. Transient voltage for each applied ESD pulse is measured and provided for a better understanding of the DUT’s ESD clamping response. Standard ESD Simulator pulse levels are +/-8kV, but other levels can be applied upon request.

  • AD & CD Clamping Voltage Waveform @ + & – 8 kV
Transient Behavior Modeling

Based on TLP and vf-TLP test results, ESDEMC will generate a device model if requested. Positive and negative IV characteristics will be matched with TLP results, and transient vf-TLP turn-on behavior will be modelled at various pulse levels. Board-level modelling may also be possible, but it should be discussed prior to testing.  Advanced Design System (ADS) and Spice are the standard simulation programs used to generate these models, and models can be made “classified” when intellectual property is a concern. This allows users to share their device models with others without revealing the internal model components.

Long Pulse EOS (200ns – 1mS) Failure Testing

While TLP provides clean rectangular pulses up to 100’s of nanoseconds (and pulses with sag up to a couple microseconds), some test applications require much longer pulse duration. For these applications, ESDEMC provides long pulse EOS testing. The EOS is a solid-state pulser that can output clean rectangular pulses from 200ns to 1ms at very fine steps. By default, this is a 50-ohm pulser like the TLP, but different output impedances can be configured if requested. This may be useful in higher-current pulsing. The 50-ohm EOS can output pulses up to 1kV. These tests are often useful for generating SOA curves, Wunsch-Bell curves, or just analyzing transient behavior across a longer timescale.

Low Voltage Surge (8/20 & 10/1000 us) Pulsed Failure Testing

Many protection devices require a surge rating for qualification. ESDEMC provides its low voltage surge testing service to aid in understanding component surge performance. ESDEMC’s surge test systems will inject a surge pulse into the device, capture the transient voltage and current, test for failure, and move onto the next pulse level. Not only does automation of surge testing set ESDEMC apart from other surge testers, but ESDEMC’s testers output linear in-spec waveforms from 500mA up to >250A.  The standard available waveforms are the 8/20us and 10/1000us surges.

CDM (Charged Device Model) Testing

Related Standards:

  • ANSI/ESDA/JEDEC JS-002-2018 (FICDM)
  • AEC Q100-011 Rev-D (2019 Ver. follows JS-002)
  • AEC Q101-005 Rev-A (2019 Ver. follows JS-002)
HBM (Human Body Model) & MM (Machine Model) Testing

Related Standards:

  • ANSI/ESDA/JEDEC JS-001-2017
LI-CCDM (Low Impedance -Contact first CDM)

Related Standards:             

  • ANSI/ESD SP5.3.3-2018
CC-TLP Testing

 Related Standards:

  • ANSI/ESD DSP5.3.X-202X
CDE (Cabe Discharge Event) Testing

Cable discharge events occur when a cable, such as ethernet, HDMI, or USB, is plugged into a system whose potential differs enough to cause an electrostatic discharge. These discharges can be detrimental to the board or system. Factors such as cable charge level, cable length, and pin contact sequence can affect the severity of the discharge. ESDEMC provides a means of discharging different cable types of specific length and voltage into your board or system. Pin contact sequence can be controlled, and the electrical state of each pin can be set prior to discharge. The discharge current waveforms can be saved and captured for up to 8 pins, and failure analysis can be performed by request.

Calibration Services
Design Services

ESDEMC Technology LLC is an experienced technology group specializing in the development and manufacturing of test and measurement products and services. Our team has extensive experience in the development of challenging designs for high voltage and high frequency applications.

Our design capability covers the following areas:

  1. High-speed analog and digital designs
  2. Hardware development including microcontroller/DSP/ FPGA
  3. High frequency development up to 40 GHz
  4. High voltage development up to 100 KV
  5. Software programming projects including Python/LabVIEW /C++/C#
  6. Mechanical design, CNC machining, 3D printing

Contact us

US Rolla Office

Email: info@esdemc.com

Phone (US): +1 (573) 202-6411

Address (US): 2001 Forum Drive, Rolla, MO, 65401

China Beijing Office

Email: info@esdemc.cn

Phone (China): +86 (010) 6355-6649

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