Related Standards: ANSI/ESD STM5.5.1-2016, IEC 62615:2010
Introduction: Transmission Line Pulse (TLP) testing is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the device under test (DUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP). The incident and reflected pulses are evaluated, and a voltage-current (V-I) curve is developed that describes the response of an ESD protection structure to the applied TLP stresses. The Transmission Line Pulse current pulses can be on the order of amps, and the TLP test results can show the turn-on, snap-back, and hold characteristics of the ESD protection structure.
Transmission Line Pulse testing is useful in two very important ways. First, TLP may be used to characterize Input/Output (I/O) pad cells on test chips for new process technologies and Intellectual Property (IP). TLP results are very useful in developing simulation parameters, and for making qualitative comparisons of the relative merit of different ESD protection schemes for innovative pad cell designs. Secondly, TLP may be used as an electrical failure analysis tool, often in combination with conventional, standards-based component ESD testing.
ESDEMC offers a variety of TLP testing services, including Standard TLP, VF-TLP, Long Pulse TLP, Pulsed-SOA, and more.
TLP test services are quoted on a case-by-case basis, based on the scope of the work requested; estimated engineering time to perform the test and customer requested reporting. Please kindly fill out below service requirement form with your test configurations for the quote purpose.
Test Capability (customized setup available upon request):
TLP and VF-TLP testing can provide a comprehensive ESD characterization for devices. TLP (pulse width of 100ns, typically) is often used to generate an IV curve which can be analyzed to understand many of a device’s ESD protection characteristics such as dynamic resistance, trigger voltage, hold voltage, and current, and second breakdown (Vt2/It2). A VF-TLP test is often used to understand the transient response of a DUT. Initial voltage peak and turn-on time can be measured and may play a large role in choosing the best protection device for a design. When analyzing this data, it is important to understand the device under protection and the system operating conditions.
In design applications where signal integrity is important, low-loss devices at the frequencies of interest should be selected. ESDEMC’s S21 measurements will provide the customer with insertion loss data up to 26.5 GHz. Temperature and DC bias control are available upon request.