Probing could be a very time-consuming portion of device test, especially for high pin count devices with HBM where most pins are required to be tested with all possible 2-pin combinations. Fully automated test system could greatly improve the test through put, reduce time and measurement errors.
The Model ES650 automated probing system is a 2-pin probing solution for HBM, MM, TLP, HMM, CC-TLP, LI-CCDM, RP-CCDM, CDM(JS-002) on package level, wafer level, and board level devices. In addition to ESD testing solutions, the Model ES650 can be used solely for its robotic probing capabilities to precisely automate many probing applications for RF measurements, I-V curve tracing, and many other applications where precise probing is required. The probing system operates using two independently controlled (left & right) XYZ gantry with probes for contacting pins or pads on the chips or wafer. It has less parasitic compared with relay-based solutions without the need for socket PCB. Furthermore, the system support also multiple device testing, with mid-test failure checking and stop criteria for automated classification of multiple devices.
The HBM pulse module provides reliable pulsing up to 8kV with the ability to internally switch the probe connection to an SMU for leakage measurement allowing for device stressing and failure testing all in one solution. The pulse module can also internally swap the left and right probe connections to avoid needing to cross the probes during automated testing.
In addition to the HBM pulse module, the ES650 is available with modules that offer solutions for other pulsed testing such as MM and HMM as well CDM type solutions such as FICDM, LI-CCDM, CC-TLP, and RP-CCDM, a patent-pending contact first relay based CDM method. The system is also able to provide robotic probing for other testing methods such as TLP, EOS, RF probing, and many others.
Probing could be a very time-consuming portion of device test, especially for high pin count devices with HBM where most pins are required to be tested with all possible 2-pin combinations. Fully automated test system could greatly improve the test through put, reduce time and measurement errors.
The Model ES650 automated probing system is a 2-pin probing solution for HBM, MM, TLP, HMM, CC-TLP, LI-CCDM, RP-CCDM, CDM(JS-002) on package level, wafer level, and board level devices. In addition to ESD testing solutions, the Model ES650 can be used solely for its robotic probing capabilities to precisely automate many probing applications for RF measurements, I-V curve tracing, and many other applications where precise probing is required. The probing system operates using two independently controlled (left & right) XYZ gantry with probes for contacting pins or pads on the chips or wafer. It has less parasitic compared with relay-based solutions without the need for socket PCB. Furthermore, the system support also multiple device testing, with mid-test failure checking and stop criteria for automated classification of multiple devices.
The HBM pulse module provides reliable pulsing up to 8kV with the ability to internally switch the probe connection to an SMU for leakage measurement allowing for device stressing and failure testing all in one solution. The pulse module can also internally swap the left and right probe connections to avoid needing to cross the probes during automated testing.
In addition to the HBM pulse module, the ES650 is available with modules that offer solutions for other pulsed testing such as MM and HMM as well CDM type solutions such as FICDM, LI-CCDM, CC-TLP, and RP-CCDM, a patent-pending contact first relay based CDM method. The system is also able to provide robotic probing for other testing methods such as TLP, EOS, RF probing, and many others.
| Parameters | ES650-150 | ES650-300 | Units | Comments |
| XY Test Area | ≥ 150 X 150 | ≥ 300 X 300 | mm | Probe motion area |
| Z Travel | ≥ 50 | mm | ||
| X, Y, Z Step Size | 1 | μm | ||
| Reposition Repeatability | ≤ ±6 | μm | ||
| Test Voltage Range | ±1 to 2000 or 12000 | V | Customizable | |
| Test Voltage Step | 1 | V | ||
| Test Voltage Accuracy | ± 1% ± 0.1V | % V | ||
| XY Vision Resolution | 1920 X 1080 | Pixel | Allow zoom & pan | |
| Vertical Vision Resolution | 2592 X 1944 | Pixel | Allow zoom & pan | |
| Operating Temperature | 10 to 40 | (°C) | ||
| Operating Humidity | 10 to 80 | % | ||
| Power | 120-240 VAC, 50/60 Hz | VAC | ||
