ES640 Charged Device Model (CDM) Test System

Charged Device Model (CDM) electrostatic discharge is a common cause of microelectronic circuit failure. Sensitive devices can be seriously damaged or destroyed by a CDM discharge at relatively low voltage. This often occurs when the static charged device contacts a metal surface at a different potential. Such an electrostatic discharge often has an extremely fast rise time.

The Model ES640 Charged Device Model (CDM) Test System is a robotic Charged Device Model (CDM) tester designed to meet all popular CDM test methods, allowing both field induced air discharge methods (FICDM) and contact first (CCDM) methods. The system includes a computer, environment-controlled chamber, precision XYZ motion control system, different types of CDM tester heads, and an automated test and data analysis software.

Features

  • High resolution cameras (up to 3) allow for easy pin alignment operation
  • High resolution motion control system (down to 1 µm step)
  • Allows multiple devices being tested in a batch
  • Patent-pending CCDM method allows better repeatability
  • Airtight environment chamber increases drying unit efficiency
  • Support regenerative drying unit (no need of nitrogen)

Description

ES640 Charged Device Model (CDM) Test System DATASHEET (PDF)

1.    Introduction

Charged Device Model (CDM) electrostatic discharge is a common cause of microelectronic circuit failure. Sensitive devices can be seriously damaged or destroyed by a CDM discharge at relatively low voltage. This often occurs when the static charged device contacts a metal surface at a different potential. Such an electrostatic discharge often has an extremely fast rise time.

The Model ES640 Charged Device Model (CDM) Test System is a robotic Charged Device Model (CDM) tester designed to meet all popular CDM test methods, allowing both field induced air discharge methods (FICDM) and contact first (CCDM) methods. The system includes a computer, environment-controlled chamber, precision XYZ motion control system, different types of CDM tester heads, and an automated test and data analysis software.

2.    Features

  • High resolution cameras (up to 3) allow for easy pin alignment operation
  • High resolution motion control system (down to 1 µm step)
  • Allows multiple devices being tested in a batch
  • Patent-pending CCDM method allows better repeatability
  • Airtight environment chamber increases drying unit efficiency
  • Support regenerative drying unit (no need of nitrogen)

3.    Applications

  • General charged device model (CDM) system for package and wafer level tests
  • Support many popular latest CDM methods:
    • ANSI/ESDA/JEDEC JS-002-2018 (FICDM)
    • AEC Q100-011 Rev-D (2019 Ver. follows JS-002)
    • AEC Q101-005 Rev-A (2019 Ver. follows JS-002)
    • ANSI/ESD SP5.3.3-2018 (LI-CCDM, vf-TLP required)
    • CC-TLP (ESDA SP pending, vf-TLP required)
    • Patent pending RP-CCDM method
    • Legacy and customized solutions available upon request
  • Customizable dimension for robotic CBM (Charged Board Model) and flat panel ESD test

4.    Specifications

 

ParametersES640-150ES640-300UnitsComments
XY Test Area≥ 150 X 150≥ 300 X 300mmCustomizable
Z Travel≥ 50≥ 150mm
X, Y, Z Step Size100nm
Reposition Repeatability≤ ±6μm
Test Voltage Range±5 to 2000 or 4000VCustomizable
Test Voltage Step1V
Test Voltage Accuracy± ≤ 1%
XY Vision Resolution1280 X 720Pixel
Vertical Vision Resolution2592 X 1944PixelAutofocus
Operating Temperature10 to 40(°C)
Operating Humidity10 to 80%
Power120-240 VAC, 50/60 HzVAC