ES62X-CPW Wafer Level TLP SOLZ Calibration Kit

 Features:

  • High-quality substrate for TLP/VF-TLP system wafer-level calibration
  • Probing pitch range from 60 µm (or 200 µm) up to 3 mm
  • 12 precision resistors in the values of 0.1, 0.2, 0.51, 1, 2, 4.99, 10, 20, 49.9, 100, 200 and 499 Ω and for the calibration of TLP current measurement channel
  • 6 reference Zener-diodes in the range of 2.4, 5.1, 10, 20, 33, and 110 V for calibration of the voltage measurement channel
  • 3 transient voltage suppressor (TVS) diodes for reference measurement of calibrated TLP/VF-TLP system
  • 84 open-load and 84 short-circuit test structures

Description

 ES62X-CPW Wafer Level TLP SOLZ Calibration Kit Datasheet (PDF)

 

1.    Description

The TLP measurement errors are partially caused by the combination of the probing contacts resistance, interconnection loss and mismatch, inaccuracy of attenuation values, and oscilloscope offset & scale errors. These errors are can be minimized by the Short-Open-Load-Zener (SOLZ) calibration method (per ESDA TR5.5-02-08 Transmission Line Pulse Round Robin). Different values of the reference devices are available on the ES62X-CKW to calibrate TLP measurement system in the desired voltage and current range where the device under test (DUT) is to be expected. The Anode of diodes is always placed on the small pad, and the Cathode is placed on the “L” shaped pad.

The substrate material is FR4, and has a rugged top layer gold coating. The test structure probing gap is 50 µm (depending on model) which is suitable for probe pitch in the range from 70 µm up to 3 mm. The size of the substrate is 40 mm x 40 mm. The total height including reference devices is about 2.8 mm. The substrate is packed in a protective case. The calibrated specification sheet is included.

 

2.    Features

  • High-quality substrate for TLP/VF-TLP system wafer-level calibration
  • Probing pitch range from 70 µm (or 200 µm) up to 3 mm
  • 12 precision resistors in the values of 0.1, 0.2, 0.51, 1, 2, 4.99, 10, 20, 49.9, 100, 200 and 499 Ω for the calibration of TLP current measurement channel
  • 6 reference Zener-diodes in the range of 2.4, 5.1, 10, 20, 33, and 110 V for calibration of the voltage measurement channel
  • 3 transient voltage suppressor (TVS) diodes for reference measurement of calibrated TLP/VF-TLP system
  • 84 open-load and 84 short-circuit test structures

 

3.    Applications

  • Wafer level TLP measurement SOLZ calibration

 

4.    Specifications

Parameters Values Unit Comments
Resistance of resistors
0.1, 0.2, 0.51, 1, 2, 4.99,

10, 20, 49.9, 100, 200, 499

1 % precision (12 total)
Break Dow of Z-diodes 2.4, 5.1, 10, 20, 50, 110 V 2 % precision (6 total)
Breakdown voltage of TVS 8 17 7 V
Dynamic Resistance, RDYN 0.5 0.45 0.29
Max TLP Current of TVS >50 >20 >100 A Tested with 100 ns TLP
Junction Capacitance of TVS 17 0.1 150 pF
Metal Surface Process Gold Plated NA
Test Pad Separation 50 (±5) µm

5.    Ordering Information

 

Line Part # or Option # Description Status
1 ES62X-CKW-1 Wafer Level TLP SOLZ Calibration Kit, 150 µm separation Obsolete since 2018
2 ES62X-CKW-2.1 Wafer Level TLP SOLZ Calibration Kit, 50 µm separation Active

Customized design might be available upon request

Additional information

Weight 0.5 kg
Dimensions 20 × 20 × 10 cm
Test Structure Probing Gap

30 µm, 150µm

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