ES620 Compact TLP IV-Curve System

The ES620 Compact Pulsed IV-Curve Test and Analysis System is our new development for 2015.  It is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, vf-TLP, HMM, HBM, EFT, and LV-Surge.  It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc…) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.

Features:

  • Most configurable TLP Pulsed IV-Curve System
  • Ultra-Compact Design System
  • Ultra-fast Speed with multi-thread processing
  • Currently 25 A, 50 A,and 100 A models available
  • High quality TLP pulses
  • Test Function Expandable with vf-TLP, HMM, HBM, and LV-Surge options
  • Automatic failure detection methods including:
    DC Spot Check (V or I), Static IV, Fuse, Breakdown, Bias Source Fluctuation, and customization available
  • Software controlled pulsing: Burst, Continuous, IV-Curve Characterization
  • Rise-Time options from 60 ps to 50 ns *(depends on model)
  • Pulse-Width options from 1 ns to 3200 ns  *(depends on model)

 

Description

ES620 Compact TLP Pulsed IV-Curve System Datasheet (PDF)

The ES620 Compact Pulsed IV-Curve Test and Analysis System is our new development for 2015.  It is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, vf-TLP, HMM, HBM, EFT, and LV-Surge.  It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc…) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.

The Transmission Line Pulse (TLP) test and analysis function is designed to meet ANSI/ESD STM5.5.1-2014 test standards. Our system generates high quality rectangular pulses to devices while recording both the current thru and voltage across the device.  This gives a pulsed IV curve that allows users to characterize the device’s transient response in nanosecond time windows.  Advanced automatic device failure detection methods, such as leakage testing, static IV curve, and fuse and spark, are incorporated.

The very fast TLP (vf-TLP) test and analysis function is designed to meet ANSI/ESD SP5.5.2-2007 test standard practice.  The vf-TLP test function is designed to simulate the CDM speed ESD event and captures the current thru and voltage across the device under very high speeds (approximately 100 ps rise-time).  This allows the user to study the response speed and peak voltage of a device.

The Human Metal Model (HMM) test and analysis function is designed to meet ANSI/ESD SP5. 6-2009 test standard practice alternative test method for IC to IEC61000-4-2 system level ESD.  It gives equivalent waveform to an ideal standard waveform for low Ohmic devices and eliminates many IEC gun test problems, such as repeatability, imprecise gun tip, impedance mismatch, EMI interferences from unshielded relays, and special set-up with large ground planes and coupling planes, for component or wafer level tests.

This system features complete software control and customizable rise-time and pulse width selections, great compatibility with IVI instruments, compact size, and an affordable price.

 

Applications:

  • Wafer level ESD testing
  • PCB/package level ESD testing
  • System/circuit ESD testing
  • Safe Operation Area (SOA) testing
  • Charge recovery time testing
  • Differential ESD pulse injection
  • Touchscreen ITO trace fuse testing
  • Touchscreen ITO trace spark testing
  • TLP pulse current injection meets and exceeds ANSI/ESD STM 5.5.1-2008
  • vf-TLP pulse current injection meets and exceeds ANSI/ESD SP5.5.2-2007
  • HMM pulse current injection equivalent to IEC61000-4-2 waveform for low Ohmic devices

 

Specifications:

 

ES620 Transmission Line Pulse Base IV-Curve System

Parameters ES620-25 ES620-50 ES620-100 Unit Comments
Output voltage @ open load ± 0.5 ~ 1250 ± 0.5 ~ 2500 ± 0.5 ~ 5000 V
Output voltage @ 50 Ω load ± 0.25 – 625 ± 0.5 ~ 1250 ± 0.5 ~ 2500 V
Min voltage step @ 50 Ω load
from Min to 40 V
0.01 0.01 0.02 V with 46 dB reflection rejection
Min voltage step @ 50 Ω load
from 40V to Max
0.1 0.1 0.2 V with 6 dB reflection rejection
Output voltage precision Better than 5 % % After self-calibration
Output current @ short load ± 0.01 ~ 25 ± 0.02 ~ 50 ± 0.04 ~ 100 A
Output current @ 50 Ω load ± 0.005 ~ 12.5 ± 0.01 ~ 25 ± 0.02 ~ 50 A
Peak power @ 50 Ω load ≥ 7.813 ≥ 31.25 ≥ 125 kW
Intrinsic TLP rise-time ≤ 0.2 ≤ 0.2 ≤ 0.3 ns 60 ps option available on ES620-25
Other rise-time options 0.06 ~ 50 ns Depends on model, check table 2
Intrinsic TLP pulse width 100 ± 1 ns Default
Other pulse-width options 1 ~ 3200 5 ~ 1000 5 ~ 1000 ns Depends on model, check table 3
Test repetition time Typical 0.2 ~ 2 s OSC, SMU and state dependent
Dimensions 347 X 300 X 145 mm
Weight 5 6 8 kg
Direct I &V Measurement method Direct I &V Probe A6213-T1 (CT-2 and 1K Pick-T) and Method included, Direct IV Probe is CT-2 and 1K Pick-T
Supported oscilloscopes All models from Tektronix, Agilent, LeCroy, Rigol. Others will be supported on

request

Supported SMU Keithley 24xx/26xx series SMU Others will be supported on

request

 

ES620-HMM1 External Human Metal Model Module
(short circuit DUT, 100 Ω HMM per ANSI/ESD SP5.6-2009)

Parameters ES620-25 ES620-50 ES620-100 Unit Comments
HMM first peak current 22.5 45 90 A 3.75 A per 1 kV ≤ ± 10 %

IEC 61000-4-2 (R=330Ω, C=150pF)

HMM current @ 30 ns 12 24 48 A ≤ ± 10 % (better than ±30% IEC )
HMM current @ 60 ns 6 12 24 A ≤ ± 10 % (better than ±30% IEC )

 

ES620-HBM1 External Human Body Model Module
(ANSI/ESDA/JEDEC JS-001-2014 R=1.5 kΩ, C=100 pF)

Parameters ES620-25 ES620-50 ES620-100 Unit Comments
Maximum HBM Test Level ± 2 ± 4 ± 8 Kv
Minimum HBM Test Level ± 10 V
Minimum Test Level Step 1 V PCB controlled via USB
Charge Removal Resistance 10 K Ohm
Voltage Output Sensitivity 1/201 V/V ± 3% into 50 Ohm
Current Sensor Sensitivity 1 V/A ± 3% into 50 Ohm
DC Test Series Resistance
Measurement Repetition Time >= 1 S Per Standard 1P/S Maximum
Physical Dimensions 90 X 90 X 130 mm

 

ES620-LVS1 External Low Voltage Surge Module
(TBD)

 

Ordering Information:

Line Part # or Option # Description
TLP IV-Curve System Basic Configuration
1.1 ES620-25 ES620 Compact TLP IV-Curve System, 25 A Base Unit
1.2 ES620-50 ES620 Compact TLP IV-Curve System, 50 A Base Unit
1.3 ES620-100 ES620 Compact TLP IV-Curve System, 100 A Base Unit
Pulse Rise-time Options
2.1 ES620-VF Upgrade Intrinsic TLP rise-time to the faster limit
2.2 ES62x-PRT4 Programmable pulse rise-time filter X4 module
(Default:   Intrinsic, 1 ns, 5 ns, 10 ns, customization available)
2.3 ES62x-PRT7 Programmable pulse rise-time filter X7 module
(Default:   Intrinsic, 0.5ns, 1 ns, 2ns, 5 ns, 10 ns, 20ns, customization available )
2.4 ES62x-ERTF External Rise-time Filter (customizable from 0.1 ~ 50 ns)
Pulse Width Options
3.1 ES620-MPLEx Manual Pulse Width External Change Option
3.2 ES620-PPL4 Programmable Internal pulse length X4 module
3.3 ES620-PPL7 Programmable Internal pulse length X7 module
External Pulse Module Options
4.1 ES620-HBM1 Human Body Model (HBM) ESD Pulse Module and Measurement Setup Option

(ANSI/ESDA/JEDEC JS-001-2014 Pulse Test with IV Measurement)

4.2 ES620-HMM1 Human Metal Model (HMM) ESD Pulse Module and Measurement Setup Option

( IEC61000-4-2 Pulse Test with IV Measurement)

4.3 ES620-LVS1 Low Voltage Surge Pulse Module and Measurement Options

( IEC61000-4-5 Pulse Test with IV Measurement)

DC Bias & Leakage Measurement Options
5.1 ES62X -LTK2400 Leakage Measurement Options with Keithley 2400 SMU integrated
5.2 ES62X -LTKSEM Leakage Test Switch Module for Single Port ESD Injection
5.3 ES62X -BTK2220 Programmable Dual Channel DC Supply integrated with TLP for Biasing Control
5.4 ES62X-BT1 High Frequency TLP Test Bias Tee, 300 k – 20 GHz, 1A DC Current.
5.5 ES62X-BT2 High Current TLP Test Bias Tee, 30K-6GHz, 2A DC Current
ESD Injection and IV-Curve Measurement Options
6.1 ES62X-CTX Overlap-TDR Measurement Setup for Component Test
6.2 ES62X-VFM Non-overlap TDR Measurement Setup for High Speed VF-TLP Test
6.3 ES62X-CMPS Compact Manual Probe Station with flexible moving vacuum chuck and microscope
6.4 ES62x-XYZR Precision XYZ Micro Manipulator Set for probing with 2 coaxial high-resolution 100:1 (or 50:1) rotary probe holders, 2 straight mounting probe holders
6.5 ES62x-DIFESD Differential ESD Injection and IV measurement option
6.6 ES62x-PT1 Low Frequency Voltage Measurement Pick Tee
6.7 ES62x-PT2 High Frequency Voltage Measurement Pick Tee
Oscilloscope Paired with TLP System
  ES62X-OS1000 Digital oscilloscope with 1 GHz BW, 4CH (Recommended for TLP, HMM, HBM, and surge test)
  ES62X-OS4000 Digital oscilloscope with 4 GHz BW, 4CH (Recommended for VF-TLP test)
 
 

Customized solutions might be available upon request

Additional information

Max SL Current

25A, 50A, 100A