ES612 ESD TESTER (HBM, HMM, MM) [Obsolete]

The model ES612 ESD Tester is a 2 Pin tester designed for the evaluation of devices at both wafer level and package level. The tester is designed to carry HBM, HMM and MM ESD standards. Determination of ESD failure thresholds is made easy using one of the external DC characterization measurement capabilities.

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

Features

  • Low Parasitic HBM/HMM/MM tester with high quality pulses
  • Very configurable and expandable
  • Friendly for probe station
  • Automatic External Module Detection
  • Large Touch Panel and Firmware Upgradable
  • Optional Software Controlled Automated Pulse and Failure Measurement
  • Optional Pulsed IV and DC IV Characterization

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Description

1. Description

Model ES612 is obsolete since 2022, the replacement model is ES612A

The model ES612 ESD Tester is a 2 Pin tester designed for the evaluation of devices at both wafer level and package level. The tester is designed to carry HBM, HMM and MM ESD standards. Determination of ESD failure thresholds is made easy using one of the external DC characterization measurement capabilities.

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

2. Features

  • Low Parasitic HBM/HMM/MM tester with high quality pulses
  • Very configurable and expandable
  • Friendly for probe station
  • Automatic External Module Detection
  • Large Touch Panel and Firmware Upgradable
  • Optional Software Controlled Automated Pulse and Failure Measurement
  • Optional Pulsed IV and DC IV Characterization

3. Applications

  • General device level ESD test for wafer, packaged, PCB and system devices
  • HBM module meets ANSI/ESDA/JEDEC JS-001-2017, MIL-STD-883 and MIL-STD-750
  • HMM module meets ANSI/ESD SP5.6-2019, 50 Ohm Method
  • MM module meets ANSI/ESD STM5.2-2019

4. Specifications

ES612 Controller Options

Parameters ES612-2K ES612-4K ES612-6K ES612-8K ES612-12K ES612-20K Unit
Output voltage ± 10 ~ 2000 ± 10 ~ 4000 ± 10 ~ 6000 ± 10 ~ 8000 ± 10 ~ 12000 ± 10 ~ 20000 V
Output voltage step 1V up to 500V,

10V up to 2 kV

1V up to 500V,

10V up to 4 kV

1V up to 500V,

10V up to 6 kV

1V up to 500V,

10V up to 8 kV

1V up to 500V,

10V up to 12 kV

1V up to 500V,

10V up to 20 kV

V,

kV

Output voltage precision Better than ± 1 % ± 5 V %
Dimensions 347 X 300 X 145 mm
Weight 5 6 6 6 6 7 kg
V and I Measurement Passive voltage and current probes
Supported Oscilloscopes Majority models from Keysight, Tektronix, LeCroy.
Supported SMU Keysight 2900 Series, Keithley 24xx/26xx series SMU.

 

 

HBM External Human Body Model Module

(Per ANSI/ESDA/JEDEC JS-001-2017)

Parameters HBM-2 HBM-4 HBM-6 HBM -8 HBM -12 HBM -20 Unit
Output voltage ± 10 ~ 2000 ± 10 ~ 4000 ± 10 ~ 6000 ± 10 ~ 8000 ± 10 ~ 12000 ± 10 ~ 20000 V
Discharge RC Value C: 100 pF ± 10%, R: 1.5kΩ ± 1%
Short Load Peak Current Ips 0.67A ± 10 % per kV ns
Short Load Rise Time Trs 2 < Trs < 10 ns
Short Load Decay Time Tds 130 < Tds < 170 ns
Short Load Ringing Irs < 15% of Ips
500 Load Peak Current Ipr Ipr/Ips ≥ 63%
500 Load Rise Time Trr 5 < Trr < 25 ns

 

HMM External Human Metal Model Module
(
Per ANSI/ESD SP5.6-2019)

Parameters HMM-8 HMM-24 HMM-36 Unit Comments
HMM first peak current 90 90 135 A 3.75 A per 1 kV ≤ ± 10 %

IEC 61000-4-2 (R=330Ω, C=150pF)

HMM current @ 30 ns 48 48 72 A ≤ ± 10 % (better than ±30% IEC )
HMM current @ 60 ns 24 24 36 A ≤ ± 10 % (better than ±30% IEC )

 

 

MM External Machine Model Module

(Per ANSI/ESD STM5.2-2019)

Parameters MM-2 MM-4 Unit Comments
Output Voltage ±10 ~ 2000 ±10 ~ 4000 V
Discharge RC Value C: 200 pF, R: 0 Ω
Short Load Peak Current Ip1 1.75±10% per 100V A Tolerance may be different if socket is used
Short Load Ip2 67% ~ 90% of Ip1 A
Short Load Pulse Period tpm 66 < tpm < 90 ns
500 Ω Load Peak Current Ipr 0.85 – 1.2 A @400V condition per standard
500 Ω Load I100 0.23 – 0.4 A @400V condition per standard
500 Ω Load I200 30 -50% of measured I100 A

5. Ordering Information

Line Part # or Option # Description
ESD Tester
1.1 ES612-2K ES612 ESD Tester, Max 2kV, RS232 SCPI Supported
  ES612-4K ES612 ESD Tester, Max 4kV, RS232 SCPI Supported
  ES612-6K ES612 ESD Tester, Max 6kV, RS232 SCPI Supported
  ES612-8K ES612 ESD Tester, Max 8kV, RS232 SCPI Supported
  ES612-12K ES612 ESD Tester, Max 12kV, RS232 SCPI Supported
  ES612-20K ES612 ESD Tester, Max 20kV, RS232 SCPI Supported
1.2 ES612-HBM-2 Human Body Model 2 Pin Module, 2kV
  ES612-HBM-4 Human Body Model 2 Pin Module, 4kV
  ES612-HBM-6 Human Body Model 2 Pin Module, 6kV
  ES612-HBM-8 Human Body Model 2 Pin Module, 8kV
  ES612-HBM-12 Human Body Model 2 Pin Module, 12kV
  ES612-HBM-20 Human Body Model 2 Pin Module, 20kV
1.3 ES612-HMM-8 Human Metal Model 2 Pin Module, 8kV equivalent HMM
  ES612-HMM-24 Human Metal Model 2 Pin Module, 24kV equivalent HMM
  ES612-HMM-36 Human Metal Model 2 Pin Module, 36kV equivalent HMM
1.4 ES612-MM-2 Machine Model 2 Pin Tester Module, 2kV
  ES612-MM-4 Machine Model 2 Pin Tester Module, 4kV
Accessories
2.1 CT-002-T Current Probe 1kHz to 2 GHz (Better than Tektronix CT1 & CT2)
2.2 ES62X-CMPS Compact Manual Probe Station
2.3 XYZM XYZ Micropositioner, XYZ travel 500 mils with 0.01mm per step
2.4 XYZM-HBM HBM Probe Arm Assembly
2.5 XYZM-HMM HMM Probe Arm Assembly (47.5R)
2.6 HBM-TC0.3 0.3 mm Pitch Test Clip for Packaged IC Probe
2.7 HBM-TC2.5 2.54 mm Pitch Test Clip for PCB Probing (default conf include 1 set)
2.8 XYZM-PP048 0.48 mm Pogopin for package level test (pack of 20)
2.9 XYZM-TN1 Tungsten Needles – 5 mils sharp tip, for wafer level test (pack of 10)
Third Party
3.1 KSMU2400 SMU, 200V, 1A, 20W, Single Channel (For device DC automation failure check))
3.2 OSC-1G 1 GHz BW, 5Gs/S, 4Ch Oscilloscope

 

Documents

ES612 ESD TESTER (HBM,HMM,MM) DATASHEET (PDF)