ES612 ESD TESTER (HBM, HMM, MM)

The model ES612 ESD Tester is a 2 Pin tester designed for the evaluation of devices at both wafer level and package level. The tester is designed to carry HBM, HMM and MM ESD standards. Determination of ESD failure thresholds is made easy using one of the external DC characterization measurement capabilities. The unit can be expanded with our automatic multi-pin device tester and be used as part of your device qualification process, providing supplemental data to the results gathered when using an automated ESD test solution.

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

Features

  • Low Parasitic HBM/HMM/MM tester with high quality pulses
  • Very configurable and expandable
  • Friendly for probe station
  • Automatic External Module Detection
  • Large Touch Panel and Firmware Upgradable
  • Optional Software Controlled Automated Pulse and Failure Measurement
  • Optional Pulsed IV and DC IV Characterization

Description

ES612 ESD TESTER (HBM,HMM,MM) DATASHEET (PDF)

1. Description

The model ES612 ESD Tester is a 2 Pin tester designed for the evaluation of devices at both wafer level and package level. The tester is designed to carry HBM, HMM and MM ESD standards. Determination of ESD failure thresholds is made easy using one of the external DC characterization measurement capabilities. The unit can be expanded with our automatic multi-pin device tester and be used as part of your device qualification process, providing supplemental data to the results gathered when using an automated ESD test solution.

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

2. Features

  • Low Parasitic HBM/HMM/MM tester with high quality pulses
  • Very configurable and expandable
  • Friendly for probe station
  • Automatic External Module Detection
  • Large Touch Panel and Firmware Upgradable
  • Optional Software Controlled Automated Pulse and Failure Measurement
  • Optional Pulsed IV and DC IV Characterization

3. Applications

  • General device level ESD test for wafer, packaged, PCB and system devices
  • HBM module meets ANSI/ESDA/JEDEC JS-001-2014
  • HMM module meets ANSI/ESD SP5.6-2009, 50 Ohm Method
  • MM module meets ANSI/ESD STM5.2-2012

4. Specifications

ES612 Controller Options

ParametersES612-2KES612-8KES612-12KES612-20KUnit
Output voltage ± 10 ~ 2000± 10 ~ 8000± 10 ~ 12000± 10 ~ 20000V
Output voltage step1V up to 500V,

10V up to 2 kV

1V up to 500V,

10V up to 8 kV

1V up to 500V,

10V up to 12 kV

1V up to 500V,

10V up to 20 kV

V,

kV

Output voltage precisionBetter than ± 1 % ± 5 V%
Dimensions347 X 300 X 145mm
Weight5667kg
V and I Measurement Passive voltage and current probes
Supported OscilloscopesMajority models from Keysight, Tektronix, LeCroy.
Supported SMUKeithley 24xx/26xx series SMU.

HBM External Human Body Model Module

ParametersHBM-2KHBM -8KHBM -12KHBM -20KUnit
Output voltage ± 10 ~ 2000± 10 ~ 8000± 10 ~ 12000± 10 ~ 20000V
Discharge RC ValueC: 100 pF ± 10%, R: 1.5kΩ ± 1%
Short Load Peak Current Ips0.67A ± 10 % per kVns
Short Load Rise Time Trs2 < Trs < 10ns
Short Load Decay Time Tds130 < Tds < 170ns
Short Load Ringing Irs< 15% of Ips
500  Load Peak Current IprIpr/Ips ≥ 63%
500  Load Rise Time Trr5 < Trr < 25ns

HMM External Human Metal Model Module
(short circuit DUT, 100 Ω HMM per ANSI/ESD SP5.6-2009)

ParametersHMM-24KUnitComments
HMM first peak current90A3.75 A per 1 kV ≤ ± 10 %

IEC 61000-4-2 (R=330Ω, C=150pF)

HMM current @ 30 ns48A≤ ± 10 % (better than ±30% IEC )
HMM current @ 60 ns24A≤ ± 10 % (better than ±30% IEC )

5. Ordering Information

LinePart # or Option #Description
Human Body Model 2 Pin Tester
1.1ES612ES612 ESD Tester, Max 8 kV or 20 kV, RS232 SCPI Supported
1.2ES612-HBMHuman Body Model 2 Pin Module
1.3ES612-HMMHuman Metal Model 2 Pin Module
1.4ES612-MMMachine Model 2 Pin Tester Module
Additional Options
2.1ES62x-PC-HBMPC with HBM Pulse & Failure Automation Software
2.2KSMU2400SMU, 200V, 1A, 20W, Single Channel (For device DC automation failure check))
2.3ES62X-CMPSCompact Manual Probe Station
2.4ES62X-XYZM-TIMXYZ Micropositioner – Inline model, XYZ travel 500 mils with 0.01mm per step
2.5ES62X-XYZM-PAAPCB Probe Arm Assembly with Voltage Measurement (Type C X1, Type B X2)
2.6ES62X-XYZM-GAAGND Probe Arm Assembly
2.7HBM-TC0.30.3 mm Pitch Test Clip for Packaged IC Probe
2.8HBM-TC2.52.54 mm Pitch Test Clip for PCB Probing
2.9ES62X-XYZM-PP048048 Pogopin for package level Probing
2.10ES62X-XYZM-PP075075 Pogopin for PCB level Probing
2.11ES62X-XYZM-TN1Tungsten Needles – 5 mils sharp tip, for wafer level probing