The model ES622 Series TLP Pulsed IV-Curve System is an advanced IV-curve characterization system designed to simulate ESD events (TLP/ VF-TLP/ HMM/ HBM/MM pulse) and monitor a device (semiconductors, discrete, circuit modules, etc.) in high power time domain. The ES622 has a higher specification, more functionality, greater expansion capability and better software experience compared to the previous model ES620 and ES621.
The TLP (transmission line pulse) test function is designed to meet the latest ANSI/ESD STM5.5.1 test standard and applies high quality rectangular pulses to devices and records both the voltage across and current through the device. This gives pulsed IV curves, allowing users to characterize a device’s transient response over ns time windows. Advanced automatic device failure detection methods are incorporated, such as DC Spot Check (V or I), Static IV curve, Fuse, Breakdown, and Bias Source Fluctuation.
The VF-TLP test is designed to simulate the CDM speed ESD event and captures the voltage across the DUT and current through the DUT under a high speed (such as <100 ps rise-time) ESD transient. This allows the user to study the response speed and peak clamping voltage of a device.
The HMM (Human Metal Model) test function is an alternative test method to IEC61000-4-2 system level ESD. It gives the equivalent waveform to an ideal standard waveform for low ohm devices and eliminates many IEC gun test problems for components or wafer level tests, such as repeatability, imprecision gun tip, impedance mismatches, EMI interferences from unshielded relays and special setup with large ground plane and coupling plane etc.
Note*: Longer pulse applications are supported by EOS series with pulse width from few hundred of ns to few ms.
The model ES622 Series TLP Pulsed IV-Curve System is an advanced IV-curve characterization system designed to simulate ESD events (TLP/ VF-TLP/ HMM/ HBM/MM pulse) and monitor a device (semiconductors, discrete, circuit modules, etc.) in high power time domain. The ES622 has a higher specification, more functionality, greater expansion capability and better software experience compared to the previous model ES620 and ES621.
The TLP (transmission line pulse) test function is designed to meet the latest ANSI/ESD STM5.5.1 test standard and applies high quality rectangular pulses to devices and records both the voltage across and current through the device. This gives pulsed IV curves, allowing users to characterize a device’s transient response over ns time windows. Advanced automatic device failure detection methods are incorporated, such as DC Spot Check (V or I), Static IV curve, Fuse, Breakdown, and Bias Source Fluctuation.
The VF-TLP test is designed to simulate the CDM speed ESD event and captures the voltage across the DUT and current through the DUT under a high speed (such as <100 ps rise-time) ESD transient. This allows the user to study the response speed and peak clamping voltage of a device.
The HMM (Human Metal Model) test function is an alternative test method to IEC61000-4-2 system level ESD. It gives the equivalent waveform to an ideal standard waveform for low ohm devices and eliminates many IEC gun test problems for components or wafer level tests, such as repeatability, imprecision gun tip, impedance mismatches, EMI interferences from unshielded relays and special setup with large ground plane and coupling plane etc.
Note*: Longer pulse applications are supported by EOS series with pulse width from few hundred of ns to few ms.
Related Standards:
4. Specifications
ES622 Series TLP Unit Specifications
| Typical Models | ES622-20 | ES622-50 | ES622-125 | ES622-150 | Unit | *Special models such as 40, 100, 200+ A are available per request |
| Output voltage
@ Open load |
± 0.5 ~ 1000 | ± 0.5 ~ 2500 | ± 0.5 ~ 6250 | ± 0.5 ~ 7500 | V | |
| Min Voltage step
@ Open load |
0.1 | 0.1 | 0.1 | 0.1 | V | |
| Output current
@ Short load |
± 0.01 ~ 20 | ± 0.01 ~ 50 | ± 0.01 ~ 125 | ± 0.01 ~ 150 | A | |
| Voltage precision | Accuracy adjustable between 1 – 10 % | % | Speed / accuracy software adjustable | |||
| Fastest rise-time* (default 20-80%) |
≤ 50 | ≤ 200 | ≤ 300 | ≤ 300 | ps | Fastest 10-90% 40 ps risetime is available with special configuration |
| Rise-time range | 0.05 ~ 1200 | 0.2 ~ 1200 | 5 ~
1200 |
5 ~
1200 |
ns | |
| Rise-time options | Unlimited programable or manual options | per customization | ||||
| Pulse-width (default 50-50%) |
100 ± 1 | ns | Default | |||
| Min Pulse-width | 0.5 | 1 | 5 | 5 | ns | |
| Max Pulse-width | 2000 | 2000 | 1500 | 1000 | ns | |
| Pulse-width options | Unlimited programable or manual options | per customization | ||||
| Test Speed | Typical 0.2 ~ 2 | Sec | Varies between hardware setups | |||
| Dimensions | 347 W X 300 D X 145 H | mm | May change per customization | |||
| Weight | 8 | 8 | 10 | 12 | kg | |
| Supported Oscilloscopes | Major Series from Tektronix, Agilent, LeCroy, Rigol. | Others supported on request | ||||
| Supported SMU | Keithley 24xx/26xx series SMU | Others supported on request | ||||
ES62X-HMM2 External Human Metal Model Module
(short circuit DUT, 100 Ω HMM per ANSI/ESD SP5.6-2009)
| @ Typical Models | ES620-25 | ES620-50 | ES620-125 | ES620-150 | Unit | Comments |
| IEC equivalent level | 6 | 12 | 30 | 36 | kV | |
| HMM peak current | 22.5 | 45 | 112.5 | 135 | A | 3.75 A per 1 kV ≤ ± 10 %
IEC 61000-4-2 (R=330Ω, C=150pF) |
| HMM current @ 30 ns | 12 | 24 | 60 | 72 | A | ≤ ± 10 % (better than ±30% IEC) |
| HMM current @ 60 ns | 6 | 12 | 30 | 36 | A | ≤ ± 10 % (better than ±30% IEC) |
ES62X-HBM2 External Human Body Model Module
(ANSI/ESDA/JEDEC JS-001-2017 R=1.5 kΩ, C=100 pF)
| @ Typical Models | ES620-25 | ES620-50 | ES620-125 | ES620-150 | Unit | Comments |
| Maximum HBM Test Level | ± 2 | ± 4 | ± 10 | ± 12 | kV | |
| Minimum HBM Test Level | ± 50 | V | ||||
| Minimum Test Level Step | 1 | V | PCB controlled via USB | |||
| Charge Removal Resistance | 10 K | Ohm | ||||
| Voltage Output Sensitivity | 1/201 | V/V | ± 3% into 50 Ohm | |||
| Current Sensor Sensitivity | 1 | V/A | ± 3% into 50 Ohm | |||
| Test Speed | >= 1 | S | Per Standard 1P/S | |||
| Physical Dimensions | 90 X 90 X 130 | mm | ||||
5. Ordering Information
| Line | Part # or Option # | Description |
| TLP IV-Curve System Basic Configuration | ||
| 1.1 | ES622-20 | ES622 TLP Pulsed IV-Curve System, 20 A Base Unit |
| 1.2 | ES622-25 | ES622 TLP Pulsed IV-Curve System, 25 A Base Unit |
| 1.3 | ES622-40 | ES622 TLP Pulsed IV-Curve System, 40 A Base Unit |
| 1.4 | ES622-50 | ES622 TLP Pulsed IV-Curve System, 50 A Base Unit |
| 1.5 | ES622-100 | ES622 TLP Pulsed IV-Curve System, 100 A Base Unit |
| 1.6 | ES622-125 | ES622 TLP Pulsed IV-Curve System, 125 A Base Unit |
| 1.7 | ES622-150 | ES622 TLP Pulsed IV-Curve System, 150 A Base Unit |
| Rise-time Options (example configuration only, customizable option available) | ||
| 2.1 | ES62x-PRT4 | Programmable pulse rise-time filter X4 module (Default: Intrinsic, 1 ns, 5 ns, 10 ns, customization available) |
| 2.2 | ES62x-PRT10 | Programmable pulse rise-time filter X10 module (Default: Intrinsic, 0.5ns, 1 ns, 2ns, 5 ns, 10 ns, 20ns, customization available) |
| 2.3 | ES62x-ERTF | Manual External Rise-time Filter
|
| Pulse-width Options (example configuration only, customizable option available) | ||
| 3.1 | ES620-PPL4 | Programmable Internal pulse length X4 module |
| 3.2 | ES620-PPL10 | Programmable Internal pulse length X10 module |
| 3.3 | ES620-MPLEx | Manual Pulse Width Extremal Change Option
|
| External Pulse Module Options | ||
| 4.1 | ES62X-HBM2 | Human Body Model (HBM) ESD Pulse Module and Measurement Setup Option
(ANSI/ESDA/JEDEC JS-001-2014 Pulse Test with IV Measurement) |
| 4.2 | ES62X-HMM2 | Human Metal Model (HMM) ESD Pulse Module and Measurement Setup Option
(IEC61000-4-2 Pulse Test with IV Measurement) |
| 4.3 | ES62X-MM2 | Machine Model (MM) ESD Pulse Module and Measurement Setup Option
(ANSI/ESDA SP5.2-2019 Pulse Test with IV Measurement) |
| Leakage or DC IV Measurement Options | ||
| 5.1 | ES62X-SSM | System Switch Module (switching between Pulse and DC test) |
| 5.2 | ES62X-STP1 | SMU Transient Protector |
| DC Bias Measurement Options | ||
| 6.1 | BT-100V2A6G | TLP Test Bias Tee, 10 kHz – 6 GHz, 100V, 2 A DC/10 A Pulse Current |
| 6.2 | BT-100V4A3G | TLP Test Bias Tee, 10 kHz – 3 GHz, 100V, 4 A DC/20 A Pulse Current |
| 6.3 | BT-450V2A5G | TLP Test Bias Tee, 10 kHz – 5 GHz, 450V, 2 A DC/10 A Pulse Current |
| ESD Injection and IV-Curve Measurement Options | ||
| 7.1 | ES62X-PSTT | TDR-O Measurement Setup for package level standard TLP test |
| 7.2 | ES62X-PVFTT | TDR-S Measurement Setup for package level VF-TLP test |
| 7.3 | ES62X-CMPS | Compact Manual Probe Station with flexible moving vacuum chuck and microscope |
| 7.4 | ES62X-WSTT | TDR-O Measurement Setup for wafer level TLP test includes micro-positioners |
| 7.5 | ES62X-WVFTT | TDR-S Measurement Setup for wafer level VF-TLP test includes micro-positioners |
| Oscilloscope Paired with TLP System | ||
| 8.1 | MISC-OSC1 | Digital Oscilloscope (1 GHz, 5 Gs, 4 Ch) (Recommended for standard TLP test) |
| 8.2 | MISC-OSC6 | Digital Oscilloscope (6 GHz, 20 Gs, 4 Ch) (Recommended for VF-TLP test) |
Many customized specifications are available upon request.
