ES620 Compact TLP IV-Curve System [obsolete]

Model ES620 is obsolete since 2022, the replacement model is Model ES622

The ES620 is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, VF-TLP, HMM, HBM, EFT and LV-Surge.  It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc…) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.

Features:

  • Most configurable TLP Pulsed IV-Curve System
  • Ultra-Compact Design System
  • Ultra-fast Speed with multi-thread processing
  • Currently 25 A, 50 A,and 100 A models available
  • High quality TLP pulses
  • Test Function Expandable with VF-TLP, HMM, HBM options
  • Automatic failure detection methods including:
    DC Spot Check (V or I), Static IV, Fuse, Breakdown, Bias Source Fluctuation, and customization available
  • Software controlled pulsing: Burst, Continuous, IV-Curve Characterization
  • Rise-Time options from 60 ps to 50 ns *(depends on model)
  • Pulse-Width options from 1 ns to 3200 ns  *(depends on model)

 

 

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Description

1.Description

The ES620 is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, VF-TLP, HMM, HBM, EFT and LV-Surge.  It will monitor the transient voltage and current waveforms during the pulse in ps or ns segments, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc…) of the device under test (DUT). Common DUT’s include protection devices, semiconductors, circuit modules, touch panel sensor, etc.

The Transmission Line Pulse (TLP) test and analysis function is designed to meet ANSI/ESD STM5.5.1 test standards. Our system generates high quality rectangular pulses to devices while recording both the current through and voltage across the device.  This gives a pulsed IV curve that allows users to characterize the device’s transient response in nanosecond time windows.  Advanced automatic device failure detection methods such as leakage testing, static IV curve, and fuse and spark are incorporated.

The very fast TLP (VF-TLP) test and analysis function is designed to meet ANSI/ESD SP5.5.2 test standard practice.  The VF-TLP test function is designed to simulate the CDM speed ESD event and captures the current through and voltage across the device under very high speeds (approximately 100 ps rise-time).  This allows the user to study the response speed and peak voltage of a device.

The Human Metal Model (HMM) test and analysis function is designed to meet ANSI/ESD SP5.6 test standard practice alternative test method for IC to IEC61000-4-2 system level ESD.  It gives equivalent waveform to an ideal standard waveform for low Ohmic devices and eliminates many IEC gun test problems, such as repeatability, imprecise gun tip, impedance mismatch, EMI interferences from unshielded relays, and special set-up with large ground planes and coupling planes, for component or wafer level tests.

This system features complete software control and customizable rise-time and pulse width selections, great compatibility with IVI instruments, compact size, and an affordable price.

We have 2 software developments, one based on LabVIEW and another based on Python.

2.Applications

  • Wafer level ESD testing
  • PCB/package level ESD testing
  • System/circuit ESD testing
  • Safe Operation Area (SOA) testing
  • Charge recovery time testing
  • Differential ESD pulse injection
  • Touchscreen ITO trace fuse testing
  • Touchscreen ITO trace spark testing
  • TLP pulse current injection meets and exceeds ANSI/ESD STM 5.5.1-2008
  • vf-TLP pulse current injection meets and exceeds ANSI/ESD SP5.5.2-2007
  • HMM pulse current injection equivalent to IEC61000-4-2 waveform for low Ohmic devices

3.Specifications

ES620 Transmission Line Pulse Base IV-Curve System

Parameters ES620-25 ES620-50 ES620-100 Unit Comments
Output Voltage @ Open Load ± 0.5 ~ 1250 ± 0.5 ~ 2500 ± 0.5 ~ 5000 V
Output Voltage @ 50 Ω Load ± 0.25 ~ 625 ± 0.5 ~ 1250 ± 0.5 ~ 2500 V
Min Voltage Step @ 50 Ω Load 0.1 0.1 0.1 V
Output Voltage Precision Better than 5 % % After self-calibration
Output Current @ Short Load ± 0.01 ~ 25 ± 0.02 ~ 50 ± 0.04 ~ 100 A
Output Current @ 50 Ω Load ± 0.005 ~ 12.5 ± 0.01 ~ 25 ± 0.02 ~ 50 A
Peak Power @ 50 Ω Load ≥ 7.813 ≥ 31.25 ≥ 125 kW
Intrinsic TLP Rise-time ≤ 0.1 ≤ 0.2 ≤ 1 ns 60 ps option available on ES620-25
Other Rise-time Options 0.1 ~ 50 0.2 ~ 50 1 ~ 50 ns
Intrinsic TLP Pulse Width 100 ± 1 ns Default
Other Pulse-width Options 1 ~ 3200 2.5 ~ 1600 5 ~ 500 ns
Test Repetition Time Typical 0.5 ~ 2 s OSC, SMU and state dependent
Dimensions 347 X 300 X 145 mm
Weight 5 6 8 kg
Direct I &V Measurement Method
Supported Oscilloscopes Major Series @ Tektronix, Agilent, LeCroy, Rigol. Others will be supported on request
Supported SMU Keithley 24xx/26xx series SMU Others will be supported on request

 

ES620-HMM1 External Human Metal Model Module
(short circuit DUT, 100 Ω HMM per ANSI/ESD SP5.6-2009)

Parameters ES620-25 ES620-50 ES620-100 Unit Comments
HMM Equivalent IEC Pulse Level 6 12 24 kV ≤ ± 10 % (better than ±30% IEC )
HMM First Peak Current 22.5 45 90 A 3.75 A per 1 kV ≤ ± 10 %

IEC 61000-4-2 (R=330Ω, C=150pF)

HMM Current @ 30 ns 12 24 48 A ≤ ± 10 % (better than ±30% IEC )
HMM Current @ 60 ns 6 12 24 A ≤ ± 10 % (better than ±30% IEC )

 

ES620-HBM1 External Human Body Model Module
(ANSI/ESDA/JEDEC JS-001-2014 R=1.5 kΩ, C=100 pF)

Parameters ES620-25 ES620-50 ES620-100 Unit Comments
Maximum HBM Test Level ± 2 ± 4 ± 8 kV
Minimum HBM Test Level ± 10 V
Minimum Test Level Step 1 V PCB controlled via USB
Charge Removal Resistance 10 K Ohm
Voltage Output Sensitivity 1/201 V/V ± 3% into 50 Ohm
Current Sensor Sensitivity 1 V/A ± 3% into 50 Ohm
DC Test Series Resistance
Measurement Repetition Time >= 1 s Per Standard 1P/s Maximum
Physical Dimensions 90 X 90 X 130 mm

4.Ordering Information

Line Part and Option Number Description
TLP IV-Curve System Basic Configuration
1.1 ES620-25 ES620 Compact TLP IV-Curve System, 25 A Base Unit
1.2 ES620-50 ES620 Compact TLP IV-Curve System, 50 A Base Unit
1.3 ES620-100 ES620 Compact TLP IV-Curve System, 100 A Base Unit
Pulse Rise-time Options
2.1 ES62x-PRT4 Programmable pulse rise-time filter X4 module
(Default:   Intrinsic, 1 ns, 5 ns, 10 ns, customization available)
2.2 ES62x-PRT7 Programmable pulse rise-time filter X7 module
(Default:   Intrinsic, 0.5ns, 1 ns, 2ns, 5 ns, 10 ns, 20ns, customization available )
2.3 ES62x-ERTF External Rise-time Filter (customizable from 0.1 ~ 50 ns)
Pulse Width Options
3.1 ES620-MPLEx Manual Pulse Width External Change Option
3.2 ES620-PPL4 Programmable Internal pulse length X4 module
3.3 ES620-PPL7 Programmable Internal pulse length X7 module
External Pulse Module Options
4.1 ES620-HBM1 Human Body Model (HBM) ESD Pulse Module and Measurement Setup Option

(ANSI/ESDA/JEDEC JS-001-2014 Pulse Test with IV Measurement)

4.2 ES620-HMM1 Human Metal Model (HMM) ESD Pulse Module and Measurement Setup Option

( IEC61000-4-2 Pulse Test with IV Measurement)

Leakage or DC IV Measurement Options
5.1 ES62X -KSMU Leakage Measurement Options with Keithley SMU

(SMU Option: 2401, 2400, 2450, 2410, 2602B, 2635B)

5.2 ES62X -SSM System Switch Module (switching between TLP and leakage tests)
DC Bias Measurement Options
6.1 KPU2230-30-1 Programmable Keithley 2230-20-1 3-Channel Programmable DC Power Supply
6.2 ES62X-BT1 TLP Test Bias Tee, 100 kHz – 6 GHz, 100V, 0.5 A DC/2.5 A Pulse Current
6.3 ES62X-BT2 TLP Test Bias Tee, 30 kHz – 6 GHz, 100V, 2 A DC/10 A Pulse Current
6.4 ES62X-BT3 TLP Test Bias Tee, 30 kHz – 4 GHz, 450V, 2 A DC/10 A Pulse Current
ESD Injection and IV-Curve Measurement Options
7.1 ES62X-PSTT TDR-O Measurement Setup for package level standard TLP test
7.2 ES62X-PVFTT TDR-S Measurement Setup for package level VF-TLP test
7.3 ES62X-CMPS Compact Manual Probe Station with flexible moving vacuum chuck and microscope
7.4 ES62X-WSTT TDR-O Measurement Setup for wafer level TLP test includes micro-positioners
7.5 ES62X-WVFTT TDR-S Measurement Setup for wafer level VF-TLP test includes micro-positioners
Oscilloscope Paired with TLP System
 8.1 MISC-OSC1 Digital Oscilloscope (1 GHz, 5 Gs, 4 Ch) (Recommended for standard TLP test)
 8.2 MISC-OSC6 Digital Oscilloscope (6 GHz, 20 Gs, 4 Ch) (Recommended for VF-TLP test)

Customized solutions might be available upon request

 

Documents

ES620 Compact TLP IV-Curve System Datasheet(PDF)