Model ES620 is obsolete since 2022, the replacement model is Model ES622
The ES620 is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, VF-TLP, HMM, HBM, EFT and LV-Surge. It will monitor the transient voltage and current waveform during the pulse in ps or ns segment, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc…) of the device under test (DUT), such as protection devices, semiconductors, circuit modules, touch panel sensor, etc.
The ES620 is an advanced and compact pulsed IV-curve characterization system designed to simulate pulsed ESD events such as TLP, VF-TLP, HMM, HBM, EFT and LV-Surge. It will monitor the transient voltage and current waveforms during the pulse in ps or ns segments, and test the pre- and post-pulse status (leakage current, breakdown voltage, biasing current, static IV curve, etc…) of the device under test (DUT). Common DUT’s include protection devices, semiconductors, circuit modules, touch panel sensor, etc.
The Transmission Line Pulse (TLP) test and analysis function is designed to meet ANSI/ESD STM5.5.1 test standards. Our system generates high quality rectangular pulses to devices while recording both the current through and voltage across the device. This gives a pulsed IV curve that allows users to characterize the device’s transient response in nanosecond time windows. Advanced automatic device failure detection methods such as leakage testing, static IV curve, and fuse and spark are incorporated.
The very fast TLP (VF-TLP) test and analysis function is designed to meet ANSI/ESD SP5.5.2 test standard practice. The VF-TLP test function is designed to simulate the CDM speed ESD event and captures the current through and voltage across the device under very high speeds (approximately 100 ps rise-time). This allows the user to study the response speed and peak voltage of a device.
The Human Metal Model (HMM) test and analysis function is designed to meet ANSI/ESD SP5.6 test standard practice alternative test method for IC to IEC61000-4-2 system level ESD. It gives equivalent waveform to an ideal standard waveform for low Ohmic devices and eliminates many IEC gun test problems, such as repeatability, imprecise gun tip, impedance mismatch, EMI interferences from unshielded relays, and special set-up with large ground planes and coupling planes, for component or wafer level tests.
This system features complete software control and customizable rise-time and pulse width selections, great compatibility with IVI instruments, compact size, and an affordable price.
We have 2 software developments, one based on LabVIEW and another based on Python.
ES620 Transmission Line Pulse Base IV-Curve System
| Parameters | ES620-25 | ES620-50 | ES620-100 | Unit | Comments |
| Output Voltage @ Open Load | ± 0.5 ~ 1250 | ± 0.5 ~ 2500 | ± 0.5 ~ 5000 | V | |
| Output Voltage @ 50 Ω Load | ± 0.25 ~ 625 | ± 0.5 ~ 1250 | ± 0.5 ~ 2500 | V | |
| Min Voltage Step @ 50 Ω Load | 0.1 | 0.1 | 0.1 | V | |
| Output Voltage Precision | Better than 5 % | % | After self-calibration | ||
| Output Current @ Short Load | ± 0.01 ~ 25 | ± 0.02 ~ 50 | ± 0.04 ~ 100 | A | |
| Output Current @ 50 Ω Load | ± 0.005 ~ 12.5 | ± 0.01 ~ 25 | ± 0.02 ~ 50 | A | |
| Peak Power @ 50 Ω Load | ≥ 7.813 | ≥ 31.25 | ≥ 125 | kW | |
| Intrinsic TLP Rise-time | ≤ 0.1 | ≤ 0.2 | ≤ 1 | ns | 60 ps option available on ES620-25 |
| Other Rise-time Options | 0.1 ~ 50 | 0.2 ~ 50 | 1 ~ 50 | ns | |
| Intrinsic TLP Pulse Width | 100 ± 1 | ns | Default | ||
| Other Pulse-width Options | 1 ~ 3200 | 2.5 ~ 1600 | 5 ~ 500 | ns | |
| Test Repetition Time | Typical 0.5 ~ 2 | s | OSC, SMU and state dependent | ||
| Dimensions | 347 X 300 X 145 | mm | |||
| Weight | 5 | 6 | 8 | kg | |
| Direct I &V Measurement Method | |||||
| Supported Oscilloscopes | Major Series @ Tektronix, Agilent, LeCroy, Rigol. | Others will be supported on request | |||
| Supported SMU | Keithley 24xx/26xx series SMU | Others will be supported on request | |||
ES620-HMM1 External Human Metal Model Module
(short circuit DUT, 100 Ω HMM per ANSI/ESD SP5.6-2009)
| Parameters | ES620-25 | ES620-50 | ES620-100 | Unit | Comments |
| HMM Equivalent IEC Pulse Level | 6 | 12 | 24 | kV | ≤ ± 10 % (better than ±30% IEC ) |
| HMM First Peak Current | 22.5 | 45 | 90 | A | 3.75 A per 1 kV ≤ ± 10 %
IEC 61000-4-2 (R=330Ω, C=150pF) |
| HMM Current @ 30 ns | 12 | 24 | 48 | A | ≤ ± 10 % (better than ±30% IEC ) |
| HMM Current @ 60 ns | 6 | 12 | 24 | A | ≤ ± 10 % (better than ±30% IEC ) |
ES620-HBM1 External Human Body Model Module
(ANSI/ESDA/JEDEC JS-001-2014 R=1.5 kΩ, C=100 pF)
| Parameters | ES620-25 | ES620-50 | ES620-100 | Unit | Comments |
| Maximum HBM Test Level | ± 2 | ± 4 | ± 8 | kV | |
| Minimum HBM Test Level | ± 10 | V | |||
| Minimum Test Level Step | 1 | V | PCB controlled via USB | ||
| Charge Removal Resistance | 10 K | Ohm | |||
| Voltage Output Sensitivity | 1/201 | V/V | ± 3% into 50 Ohm | ||
| Current Sensor Sensitivity | 1 | V/A | ± 3% into 50 Ohm | ||
| DC Test Series Resistance | |||||
| Measurement Repetition Time | >= 1 | s | Per Standard 1P/s Maximum | ||
| Physical Dimensions | 90 X 90 X 130 | mm | |||
| Line | Part and Option Number | Description | |||
| TLP IV-Curve System Basic Configuration | |||||
| 1.1 | ES620-25 | ES620 Compact TLP IV-Curve System, 25 A Base Unit | |||
| 1.2 | ES620-50 | ES620 Compact TLP IV-Curve System, 50 A Base Unit | |||
| 1.3 | ES620-100 | ES620 Compact TLP IV-Curve System, 100 A Base Unit | |||
| Pulse Rise-time Options | |||||
| 2.1 | ES62x-PRT4 | Programmable pulse rise-time filter X4 module (Default: Intrinsic, 1 ns, 5 ns, 10 ns, customization available) |
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| 2.2 | ES62x-PRT7 | Programmable pulse rise-time filter X7 module (Default: Intrinsic, 0.5ns, 1 ns, 2ns, 5 ns, 10 ns, 20ns, customization available ) |
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| 2.3 | ES62x-ERTF | External Rise-time Filter (customizable from 0.1 ~ 50 ns) | |||
| Pulse Width Options | |||||
| 3.1 | ES620-MPLEx | Manual Pulse Width External Change Option | |||
| 3.2 | ES620-PPL4 | Programmable Internal pulse length X4 module | |||
| 3.3 | ES620-PPL7 | Programmable Internal pulse length X7 module | |||
| External Pulse Module Options | |||||
| 4.1 | ES620-HBM1 | Human Body Model (HBM) ESD Pulse Module and Measurement Setup Option
(ANSI/ESDA/JEDEC JS-001-2014 Pulse Test with IV Measurement) |
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| 4.2 | ES620-HMM1 | Human Metal Model (HMM) ESD Pulse Module and Measurement Setup Option
( IEC61000-4-2 Pulse Test with IV Measurement) |
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| Leakage or DC IV Measurement Options | |||||
| 5.1 | ES62X -KSMU | Leakage Measurement Options with Keithley SMU
(SMU Option: 2401, 2400, 2450, 2410, 2602B, 2635B) |
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| 5.2 | ES62X -SSM | System Switch Module (switching between TLP and leakage tests) | |||
| DC Bias Measurement Options | |||||
| 6.1 | KPU2230-30-1 | Programmable Keithley 2230-20-1 3-Channel Programmable DC Power Supply | |||
| 6.2 | ES62X-BT1 | TLP Test Bias Tee, 100 kHz – 6 GHz, 100V, 0.5 A DC/2.5 A Pulse Current | |||
| 6.3 | ES62X-BT2 | TLP Test Bias Tee, 30 kHz – 6 GHz, 100V, 2 A DC/10 A Pulse Current | |||
| 6.4 | ES62X-BT3 | TLP Test Bias Tee, 30 kHz – 4 GHz, 450V, 2 A DC/10 A Pulse Current | |||
| ESD Injection and IV-Curve Measurement Options | |||||
| 7.1 | ES62X-PSTT | TDR-O Measurement Setup for package level standard TLP test | |||
| 7.2 | ES62X-PVFTT | TDR-S Measurement Setup for package level VF-TLP test | |||
| 7.3 | ES62X-CMPS | Compact Manual Probe Station with flexible moving vacuum chuck and microscope | |||
| 7.4 | ES62X-WSTT | TDR-O Measurement Setup for wafer level TLP test includes micro-positioners | |||
| 7.5 | ES62X-WVFTT | TDR-S Measurement Setup for wafer level VF-TLP test includes micro-positioners | |||
| Oscilloscope Paired with TLP System | |||||
| 8.1 | MISC-OSC1 | Digital Oscilloscope (1 GHz, 5 Gs, 4 Ch) (Recommended for standard TLP test) | |||
| 8.2 | MISC-OSC6 | Digital Oscilloscope (6 GHz, 20 Gs, 4 Ch) (Recommended for VF-TLP test) | |||
Customized solutions might be available upon request
