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David Pommerenke

David Pommerenke
David Pommerenke
David Pommerenke

Technology Consultant, IEEE Fellow 

Dr. Pommerenke has been our technical consultant from the founding of ESDEMC Technology. His in-depth knowledge of Electrostatic Discharge (ESD) and Electromagnetic Compatibility (EMC) has greatly helped our team in the research and development of many of our products.

 

Professional Preparation

  • Technical University Berlin, Germany, B.S.E.E, 1989.
  • Technical University Berlin, Germany, Ph.D.E.E, 1995.

 

Appointments

  • Professor, Technical University Graz, Austria, 2020-Present
  • Professor, Missouri University of Science and Technology, Department of Electrical & Computer Engineering, 2008-2019
  • Associate Professor, Missouri University of Science and Technology, Department of Electrical & Computer Engineering, 2001-2008.
  • EMC Research and Test Engineer at Hewlett Packard, Roseville, CA 1996-2001
  • Post-Doc at the Technical University Berlin, Germany 1995-1996
  • Research Assistant, Institute for High Voltage and Power Eng. Technical University Berlin, Germany 1990-1995

 

Five Most Relevant Publications

  1. Ghasr, Mohammad Tayeb, Mohamed A. Abou-Khousa, Sergey Kharkovsky, R. Zoughi, and David Pommerenke. “Portable real-time microwave camera at 24 GHz.” Antennas and Propagation, IEEE Transactions on, 2012, 60, no. 2, pp. 1114-1125.
  2. Fallahpour, M., M. Baumgartner, A. Kothari, M.T. Ghasr, D. Pommerenke and R. Zoughi, “Compact Ka-Band One-Port Vector Reflectometer using a Wideband Electronically-Controlled Phase-Shifter,” IEEE Transactions on Instrumentation and Measurement, October 2012, Vol. 61, no. 10, pp. 2817-2826
  3. Bishop, J. A.; Pommerenke, D. J.; Chen, G., ‘,A Rapid-Acquisition Electrical Time-Domain Reflectometer for Dynamic Structure Analysis ‘, IEEE Trans. Instrumentation and Measurement, 2011, Vol. 60/2 pp. 655-661,
  4. Muchaidze, G., Jayong Koo, Qing Cai, Tun Li, Lijun Han, Martwick, A., Kai Wang, Jin Min, Drewniak, J.L., Pommerenke, D., “Susceptibility Scanning as a Failure Analysis Tool for System-Level Electrostatic Discharge (ESD) Problems”, IEEE Trans. EMC, May 2008, Vol 50, No. 2, pp.268-276
  5. Koo, J., Cai, Q.; Muchaidze, G.,Martwick, A., Wang, K.; Pommerenke, D., “Frequency-Domain Measurement Method for the Analysis of ESD Generators and Coupling”, IEEE Trans. EMC, 49/3, August 2007, pp.504-511

 

Other Publications

  • Tianqi Li; Maeshima, J.; Shumiya, H.; Pommerenke, D.J.; Yamada, T.; Araki, K, “An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone”, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on, August 2012, pp. 346-350
  • Khilkevich, V.; Pommerenke, D.; Li Gang; Xu Shuai, “An inductive probe for the measurement of common mode currents on differential traces”, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on, 2012, pp. 720-724
  • Jianmin Zhang; Drewniak, J.L.; Pommerenke, D.J.; DuBroff, R.E.; Zhiping Yang; Wheling Cheng; Fisher, J.; Camerlo, S.; “Signal link-path characterization up to 20 GHz based on a stripline structure”, IEEE Int. Symp. on EMC, 2006 14-18 Aug. Vol. 2, pp.356-361
  • Bhargava, A.; Pommerenke, D.; Kam, K.W.; Centola, F.; Cheng Wei Lam; , “DC-DC Buck Converter EMI Reduction Using PCB Layout Modification,” Electromagnetic Compatibility, IEEE Transactions on , Vol.53, no.3, pp.806-813, Aug. 2011
  • Abou-Khousa, M.A.; Ghasr, M.T.; Kharkovsky, S.; Pommerenke, D.; Zoughi, R.; , “Modulated Elliptical Slot Antenna for Electric Field Mapping and Microwave Imaging,” Antennas and Propagation, IEEE Transactions on , Vol.59, no.3, March 2011, pp.733-741

 

Synergistic Activities

  • US-representative to IEC TC77b
  • Member IEEE EMC Society, TC-9, Computational Electromagnetics
  • Editorial Board, EOS/ESD Symposium on EMC (1996 – 2000)
  • Editorial Board European EMC-2002
  • Member IEEE, Electromagnetic Compatibility and Dielectrics and Electrical Insulation society

 

Collaborators & Other Affiliations

Collaborators and Co-Editors

  • Daryl Beetner, James L. Drewniak, Richard E. DuBroff, and David Pommerenke, members of the Electromagnetic Compatibility Laboratory at the Missouri University of Science and Technology
  • Bruce Archambeault, Distinguished Engineer, IBM, TRP, NC;
  • Brice Achkir, Distinguished Engineer, Cisco, San Jose, CA;

 

Graduate Advisors and Postdoctoral Sponsors

  • Masters: Prof. Dr.-Ing Wilfried Kalkner.
  • Doctoral: Prof. Dr.-Ing W. Wilfried Kalkner.
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Transmission Line Pulse (TLP) Testing

Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the pin under test (PUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP). The incident and reflected pulses are evaluated, and a voltage-current (V-I) curve is developed that describes the response of an ESD protection structure to the applied TLP stresses. The Transmission Line Pulse test is unique because the current pulses can be on the order of Amps, and the TLP test results can show the turn-on, snap-back, and hold characteristics of the ESD protection structure.

Transmission Line Pulse testing is useful in two very important ways. First of all, TLP may be used to characterize Input/Output (I/O) pad cells on test chips for new process technologies and Intellectual Property (IP). TLP is very useful in developing simulation parameters, and for making qualitative comparisons of the relative merit of different ESD protection schemes for innovative pad cell designs. Secondly, TLP may be used as an electrical failure analysis tool, often in combination with conventional, standards-based component ESD testing.

TLP testing is done according to the ESDA TLP test method, ESDA SP5.5-2014. TLP is quoted on a case by case basis, based on the scope of the work requested; estimated engineering time to perform the test, and customer requested reporting.

Applicable TLP Specs

  • ESDA SP5.5-2014 (ESD Association)
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General Project Design

General analog and digital circuit design, Radio Frequency design, PCB layout and prototyping, board population and testing. Programming of Micro Controllers, DSPs, and FPGAs. System level programming in LabView, Matlab, Visual C++, and Visual Basic. Mechanical design and machining available, and basic 3D printing.

General analog, digital, and Radio Frequency circuit design (to 40 GHz).

High voltage circuit and system design up to 100 kV.

Prototype PCB’s with board population and system testing for a turn-key solution.